Scope of Submission
We welcome submissions from a broad range of disciplines, including but not limited to:
- Advancements in electronics packaging technologies
- Thermal management in electronics packaging
- Reliability testing for electronic assemblies
- Sustainable practices in electronics packaging
- Integration of IoT in packaging systems
- Challenges in electronics assembly processes
- Quality control in electronics packaging
- Emerging materials for electronics packaging
- Design considerations for electronic assemblies
- Automation in electronics manufacturing
- Future trends in electronics packaging
- Supply chain management for electronics assembly
- Impact of 5G on electronics packaging
- Electromagnetic compatibility in packaging
- Case studies in electronics packaging engineering
- Packaging solutions for wearable electronics
- Robustness of electronic assemblies
- Testing methodologies for electronics packaging
- Industry standards for electronics packaging
- Research directions in electronics assembly
All papers must be original and not previously published or submitted elsewhere.
