Scope of Submission
We welcome submissions from a broad range of disciplines, including but not limited to:
- Properties of thermal interface materials
- Applications of TIMs in electronics cooling
- Characterization techniques for TIM performance
- Thermal conductivity measurement methods
- Innovative materials for thermal management
- Impact of surface roughness on TIMs
- Thermal interface materials in automotive applications
- Modeling heat transfer in TIMs
- Durability and reliability of TIMs
- Thermal performance of adhesive materials
- TIMs for high-power electronic devices
- Nanomaterials in thermal interface applications
- Heat transfer enhancement with TIMs
- Thermal cycling effects on TIM performance
- Future trends in thermal interface materials
- TIMs in aerospace applications
- Thermal management in wearable technology
- Advanced coatings for thermal interfaces
- Sustainability in thermal interface materials
- Challenges in TIM integration and design
All papers must be original and not previously published or submitted elsewhere.
